Axelera AI Secures More Than $250 Million Funding on Global Commercial Growth 2026-02-24 06:35:00 Financials
Chips&Media Accelerates WAVE-N Ecosystem: Redefining the Future of Next-Generation Customized NPUs 2026-02-24 06:21:26 IP Cores & Design
proteanTecs and Gubo Technologies Collaborate to Deliver Unified Analytics Solution for Advanced Semiconductor Systems 2026-02-23 16:10:00 Commercial Deals
Cadence Completes Acquisition of Hexagon’s Design and Engineering Business, Advancing Leadership in Physical AI and Multiphysics 2026-02-23 14:44:00 Commercial Deals
TES Launches its µEngine: Parallel CPU System for Deterministic Real-Time HDL Applications 2026-02-23 13:27:00 IP Cores & Design
sensiBel Licenses Sofics’ Advanced ESD Solutions for their Studio-quality MEMS Microphone Technology 2026-02-23 09:28:20 Commercial Deals
Socionext and Innatera Introduce Integrated 60 GHz FMCW Radar and Neuromorphic Edge AI for Human Presence Detection 2026-02-23 09:20:40 Commercial Deals
MIPI Specifications for Embedded Audio, Ambient AI, Smart Camera, IoT and Medical to be Featured at 2026 embedded world Exhibition & Conference 2026-02-23 07:12:01 Standards & Interconnects
M31 Validates MIPI M-PHY v5.0 IP on 4nm, Advances 3nm Development to Enable UFS 4.1 Applications 2026-02-23 06:30:00 IP Cores & Design
ASICLAND Partners with Daegu Metropolitan City to Advance Demonstration and Commercialization of Korean AI Semiconductors 2026-02-20 06:39:22 Commercial Deals
SEALSQ and Lattice Collaborate to Deliver Unified TPM-FPGA Architecture for Post-Quantum Security 2026-02-19 07:09:00 Commercial Deals
SEMIFIVE Partners with Niobium to Develop FHE Accelerator, Driving U.S. Market Expansion 2026-02-19 06:32:03 Commercial Deals
TASKING Delivers Advanced Worst-Case Timing Coupling Analysis and Mitigation for Multicore Designs 2026-02-18 15:45:00 EDA & Design Tools
Efficient Computer Raises $60 Million to Advance Energy-Efficient General-Purpose Processors for AI 2026-02-18 14:22:00 Financials
QuickLogic Announces $13 Million Contract Award for its Strategic Radiation Hardened Program 2026-02-18 12:21:57 Commercial Deals
Renesas Develops 3nm TCAM Technology Combining High Memory Density and Low Power, Suitable for Automotive SoCs 2026-02-18 06:41:02 SoC Architecture & Assembly
RaiderChip showcases the evolution of its local Generative AI processor at ISE 2026 2026-02-17 15:55:00 IP Cores & Design
ChipAgents Raises $74M to Scale an Agentic AI Platform to Accelerate Chip Design 2026-02-17 15:23:00 Financials